Event Highlights...
- LON/IP EIA-852 center stage at BuilConn Amsterdam
- Loytec, Newron, SysMik & SVEA Sponsors BuilConn
- ARUP Becomes Platinum Sponsor to BuilConn
- July Promo Email
- LonMark Co-Locates Meeting at ConnectivityWeek ™ Europe
- Hotel Booking Now Available
- European ConnectivityWeek™ Launched
BuilConn in Other Regions
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What is BuilConn?
BuilConn® is a unique event that unites all the individuals involved in buildings and IT to take an objective and comprehensive view of buildings and facilities, understand the technologies and trends that shape it, and discover the steps required to implement truly intelligent, integrated buildings.
As the gathering place for Building-IT Convergence, all issues pertaining to the evolution of this space will be presented, discussed, and developed at BuilConn.
Platinum Sponsor:
Gold Sponsor:
Co-Located With:
BuilConn is part of European ConnectivityWeek™ in Amsterdam 3-5 October 2006
