Resources

Boilerplate:

BuilConn is a three-day forum uniting the players of the building industry’s disparate disciplines including integrators, manufacturers, distributors, consultants and technologists, as well as end users and building owners to learn and discuss the trends, technologies and their applications for tomorrow’s intelligent buildings.

BuilConn is comprised of multiple industry-related events where building professionals of varying experience levels can explore the immense benefits of whole building integration in light of IT convergence. BuilConn itself is a conference and expo with multiple topics and tracks so attendees can customize their days with subjects that are relevant to them and their business.

The fourth annual event will be held in Palm Springs, CA, May 16-18, 2006, at the Palm Springs Convention Center. For further information, please visit www.builconn.com.